| 1. | The processes include the deposition of the waveguide film , the design and fabrication of the mask pattern , the lithography , the metal coating with a magnetic sputtering , the lift - off process for the metal mask , the dry deep etching by icp , the slicing of the wafer , the polishing of the cutting edge , the fiber - to - waveguide alignment and at last , the performance testing . some edg chip samples are fabricated
对设计好的集成波导器件，本论文设计并试验了器件的制作的全部工艺，包括波导薄膜的沉积，掩模的设计制作，光刻，溅射金属薄膜，剥离法制作金属掩模，干法深刻蚀，硅片切割，端面磨抛，波导对准和性能测试。 |
